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What is the principle behind selective soldering? How does it help solve soldering challenges in practical applications? This article will unveil the mystery of selective soldering through a detailed analysis of the flux system, preheating module, and soldering module, while exploring its practical application in embedded systems like Raspberry Pi development boards.
The selective soldering system uses advanced inkjet technology in order to accurately apply flux to the solder joints, effectively reducing the risk of residue and optimizing soldering quality.
Precise Application: Flux is applied in small dots using an inkjet nozzle, preventing the risk of excessive flux usage that commonly used in traditional atomization methods.
Reduced Contamination: The non-soldering areas, such as copper foil contacts on the keyboard or COD bonding surfaces, remain unaffected, ensuring the cleanliness of the PCB surface.
Optimized Cleanliness: Precise control of the flux reduces residue formation, with this intention, ensuring long-term soldering quality even in demanding environments.
Preheating Module
The preheating process facilitates the successful soldering of complex multilayer PCBs. The selective soldering equipment optimizes preheating through the following methods:
Dual-sided Heating: Our equipment can heat the PCB from both sides simultaneously, ensuring even heat distribution across all solder joints and preventing soldering failures due to temperature imbalances.
Flexibility: The temperature profile can be adjusted to accommodate various circuit board specifications in mixed production lines.
